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322 pages • missing pub info (editions)
ISBN/UID: 9781493954384
Format: Paperback
Language: English
Publisher: Springer
Publication date: 23 August 2016
Description
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging a...
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322 pages • missing pub info (editions)
ISBN/UID: 9781493954384
Format: Paperback
Language: English
Publisher: Springer
Publication date: 23 August 2016
Description
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging a...
Community Reviews
Content Warnings